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ADC: Acronym for Analog to Digital Converter. An electronic device or system that encodes analog voltage/current to a multilevel digital number. address bus: A group of signals in a microprocessor system that indicates the address of the memory location from where the data is to be read or written to. ASCII: American Standards Committee for Information Interchange. A 7-bit coding scheme for alphabets, numerals, punctuation, as well as control characters. ASIC: Acronym for Application Specific Integrated Circuit. assembler: A software program that takes a text file called the source file, and converts it into another file with the machine op-codes (simply called the machine code or object code). BCD: Acronym for Binary Coded Decimal. BOD: Brownout Detector. An electronic device that detects a drop in supply voltage below a threshold and generates a signal to reset the processor till the supply voltage is restored to acceptable level. BIT: Binary digit. bps: Acronym for Bits per Second. byte: A number with a maximum of eight bits. Thus the byte-wide number is between 0 and 255 (decimal). CISC: Acronym for Complex Instruction Set Computer. This a type of processor architecture that is characterized by a variable instruction length, usually small numbers of register and multiple address modes.

Values can range from 60 percent for very small apertures to nearly 100 percent for larger aperture openings Screen or stencil printing is the most widely used means for depositing solder paste on a surface-mount circuit board The preferred paste viscosity for screen printing is 250 to 550 kcps (kilo-centipoises) for an 80 mesh screen In the case of stencil printing, the desired viscosity is 400 800 kcps The ability to print consistently upward of tens of thousands of paste deposits per circuit board has been critical to the realization of high-volume electronics production This process is being developed for through-hole circuit boards and is referred to as paste-in-hole or pin-in-paste technology Solder paste printing technology includes stepped stencils.

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Stepped stencils are made with two different thicknesses and are used when a circuit board has such a wide range of device pitches and joint configurations that a single stencil cannot yield the optimum paste deposits for all the components The thinner sections are used for the very-fine-pitch packages, whereas the thicker sections deposit paste for the larger-pitch components These stencils are more expensive to fabricate than the single-thickness products The printing of adhesive or solder paste with a screen or stencil has several limitations It can only be performed in a single pass; if there is a fault during that pass, the board must be removed and cleaned prior to a second attempt.

Second, the circuit board surface must be flat and have no obstructions that will interfere with the stencil or screen surface sealing against the board surface as the adhesive or paste is pushed into the apertures by the squeegee As such, it is important that the screen or stencil be thoroughly cleaned of paste residues prior to use in order to minimize printing defects, which can subsequently become solder joint defects if not caught prior to reflow Third, stencils and screens wear with time, resulting in an increased number of printing defects The harder the metal or alloy, the longer is the lifetime For example, brass stencils, which are relatively inexpensive, have a short service life Stainless steel stencils have a longer lifetime, but are also considerably more expensive.

Referring to the solder paste printing process with a stencil, Pb-free solder pastes behave very similar to the Sn-Pb pastes for leaded and area-array pitches of greater than 05 mm At the smaller pitches that are characterized by smaller apertures, it has been observed that the Pb-free solders have a slightly reduced transfer coefficient The likely.

( Po Pa )

cause is the reduced density of the Pb-free solder particles, which becomes a significant factor when so few particles are passed through the aperture. Therefore, it may be necessary to slightly open up the apertures to ensure a sufficient quantity of Pb-free solder at the joint. Time-pressure pump dispensing is a method to deposit adhesive or solder paste by applying a pressure pulse for a specific time duration on a reservoir of material (see Fig. 40.17). A precisely controlled quantity of adhesive or solder paste emerges from the selected orifice size, which is deposited on the circuit board. Often, the material comes prepackaged in a syringe that is inserted into the machine.

FIGURE 40.17 Time-pressure pump dispensing technique: (a) The dispenser is positioned at the circuit board site; (b) the dispenser is lowered to near the surface at which time, a pulse of air pushes the piston a distance x to dispense a set quantity of adhesive; (c) the dispenser is raised from the site, leaving the adhesive deposit.

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