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The nature of the pin array can also allow for adhesive to be applied to the board even after through-hole parts have been put into place A similar principle to pin transfer is used for the application of flux on the solder ball of FC components for DCA (See Fig 4014) The die is immersed into a thin film bath of flux The flux depth allows only the balls to be coated so that, in effect, the solder balls become the pin, taking up the flux The flux on the solder balls is transferred with the die to the circuit board, where it provides the tack function as well as fluxing action for the solder balls during the reflow step An important consideration about the pin transfer technique is that it requires an open bath of the adhesive or flux Adhesives readily absorb water from the air.

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Fluxes lose vehicle (water or alcohol) and possibly other constituents through evaporation By either mechanism, the material properties change, which affects the quantity of fluid retained on the pin and deposited at the site (including the flip-chip process previously described) Adhesives must have sufficient wet strength, and the fluxes must have enough tack to hold the component in place for the duration of component placement activity as well as subsequent handling of the circuit board on its way to the curing oven or reflow oven Screen or stencil printing can be used for adhesives as well as solder paste The low viscosity of most flux solutions precludes their successful dispensing by this technique The adhesive or solder paste is deposited through openings in the stencil or screen called apertures The apertures are located over the locations on the circuit board where the adhesive or solder paste is required.

The placement of material is performed by a squeegee pushing a quantity of adhesive or paste ahead of it, over the screen or stencil, as illustrated by Fig 4016a..

Fig 743: A typical ultra-precision aerostatic spindle and drive system [2]

FIGURE 40.16 Screen and stencil printing: (a) the squeegee movement used to print adhesive or paste through a screen or stencil; the construction of a screen (b) and stencil (c) used for printing.

The difference between a screen and a stencil is in their respective structures, as shown in Fig. 40.16b, c. The screen is comprised of two layers: the emulsion layer and the actual screen that supports the emulsion layer. The apertures through which the adhesive or solder paste is deposited are created in the emulsion by photoimaging techniques. The adhesive or solder paste simply flows past the screen cross-hatched wires. The stencil is simply a sheet of metal or alloy (commonly Mo, Ni, brass, or stainless steel) having the apertures formed in them. The apertures can be created by one or a combination of the following techniques:

Photoimaging (photoresist definition) combined with etching by wet chemistry Laser cutting Build-up technology by electroplating processes

The choice of fabrication technique depends on the required sizes and densities of the apertures The stencil has replaced the screen in most surface-mount printing applications, not only because of its simpler construction, but also because it can accommodate finer, denser circuit board features The thickness of the screen or stencil and the size of the individual aperture openings are the parameters that control the quantity of adhesive or solder paste deposited on the circuit board Secondary factors are the aperture wall quality, the material viscosity, the hardness of the squeegee, and the speed of the squeegee In the case of solder paste, the quantity that is actually deposited is usually less than the volume of the aperture, which is the product of the width, length, and stencil thickness The degree of that discrepancy is called the transfer factor or transfer coefficient.

eccentricity ratios are used to provide a capacity to withstand an overload It is important to consider the geometrical error for the manufacturing process at this stage since the bearing clearance comes into picture Figure 744 indicates the actual load capacity that can be achieved by aerostatic bearings at a supply pressure of 100 lbf/in2 (689 kPa), which is common for industrial applications The figure is useful for obtaining a rough idea of the load capacity for a given dimension For other values of the supply pressure, the load capacity can be corrected by multiplying with

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